NTS Elite Fusion 6U Liquid-Cooled AI GPU Server | High-Density AMD EPYC

Part#: FSNA016U10-L
  • 6U 10-node front access server system
  • Dual AMD EPYC 9005/9004 Series Processors per node
  • 12-Channel DDR5 RDIMM, 24 x DIMMs per node
  • 2 x E3.S Gen5 NVMe hot-swap bays per node
  • 2 x LP PCIe Gen5 x16 slots per node
  • 10 x 3200W 80 PLUS Titanium redundant power supplies
Configure & Buy Features Specifications

New AMD EPYC™ Family of Processors - Same Great SP5 Platform

             

The SP5 socket has reached its pinnacle form with 5th Generation AMD EPYC™ processors. The same successful platform that was shared by AMD EPYC™ 9004 & 8004 series processors is now the same one for AMD EPYC™ 9005 series processors. With up to 192 cores, increased frequencies and cache, this top tier performance platform targets general purpose, cloud native, and technical computing. Building on the advantages of the EPYC™ 9004 series, the new EPYC™ 9005 series adopts the 3nm process with AMD “Zen5” and “Zen5c” core architecture, excelling in both energy efficiency and cost optimization. GIGABYTE has already prepared for this new processor with new servers and updates to existing products for 4th Gen AMD EPYC™ processors.

 

 

5th Generation AMD EPYC™ Processors for SP5 Socket

 

  • 3nm architecture Increased transistor density alongside a reduction in power consumption.
  • Up to 192 CPU cores Dedicated “Zen 5” & “Zen 5c” cores increase compute density.
  • Up to 512MB L3 cache An L3 cache increase helps to reduce latency in data-intensive operations.
  • 12 channels Memory capacity up to 9TB in a 2 DIMM per channel configuration.
  • Up to 160 PCIe lanes Dual socket configuration adds a significant amount of I/O connectivity
  • CXL 2.0 support Disaggregated compute architecture possible via Compute Express Link

 

 

Select GIGABYTE for the AMD EPYC™ 9005 Platform

 

 

 

High Performance

 

Servers and motherboards by GIGABYTE are tested to ensure peak performance for demanding workloads while supporting the latest GPU and CXL technology.

Compute Density

 

With 192 CPU cores per socket, GIGABYTE's 4-node servers support up to 1,536 CPU cores, allowing a far greater number of concurrent tasks to be done.

Fast & Stable Connectivity

 

Keeping pace with the challenges for next gen technology, well designed GIGABYTE boards provide users the signal integrity for fast PCIe 5.0 speeds.

Collaboration

 

AMD and GIGABYTE have maintained a healthy relationship that values shared knowledge and open communication in order to launch products in tandem

Optimal Price

 

Our broad portfolio of products tailored to applications allow customers to only select server features they require while doing so at a lower TCO.

Cold Redundancy

 

To take advantage of the fact that a PSU will run at greater power efficiency with a higher load, GIGABYTE has introduced a power management feature called Cold Redundancy for servers with N+1 power supplies. When the total system load falls lower than 40%, the system will automatically place one PSU into standby mode, resulting in a 10% improvement in efficiency.

 

Flexible and Resilient Management Architecture

 

  • The integration of CMC technology and auto-IP detection enables seamless switching between star and resilient ring topologies for maximum deployment flexibility. The bi-directional ring design significantly enhances cluster stability by automatically rerouting traffic upon failure to ensure uninterrupted oversight and self-healing connectivity across the remaining nodes.

 

 

 

 Dimensions6U 10-Node - Front access (W447 x H262.3 x D900 mm)
Motherboard
MZ83-HD3
CPU AMD EPYC 9005 Series Processors
 AMD EPYC 9004 Series Processors
 Dual processor per node, TDP up to 500W 
Socket 
20 x LGA 6096
ChipsetSystem on Chip
  Memory12-Channel DDR5 RDIMM, 24 x DIMMs per node
[EPYC 9005] Up to 6400 MT/s
[EPYC 9004] Up to 4800 MT/s
 LAN
Front:
1 x 10/100/1000 Mbps Management LAN per node
Rear:
2 x Chassis Management LAN
 Video
Integrated in ASPEED AST2600
- 1 x Mini-DP per node
 Storage
Front hot-swap:
2 x E3.S Gen5 NVMe per node
PCIe Expansion Slots
2 x LP PCIe Gen5 x16 per node
I/O Ports 
Front (per node):
2 x USB 3.2 Gen1, 1 x Mini-DP, 1 x MLAN
Rear:
2 x CMC ports, 1 x CMC status LED
TPM
1 x TPM header (SPI) per node, Optional TPM2.0 kit: CTM012
Power Supply 
10 x 3200W 80 PLUS Titanium redundant power supplies
AC Input: 100-240V
System Fans
10 x 80x80x80mm
Operating Properties
Operating: 10°C to 25°C, 8% to 80% (non-condensing)
Non-operating: -40°C to 60°C, 20% to 95% (non-condensing)

OPERATING SYSTEM
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