NTS HPC Cluster Services
HPC Cluster Integration & Services
Fabric bring-up, scheduler baselines, and acceptance testing. NVIDIA GB200 NVL4/NVL72, HGX B200 liquid-cooled and air-cooled systems.
HPC Cluster Services
Fabric turn-up with milestone acceptance
Engineer-to-order NTS HPC Cluster Services — configure below or request an architect-validated BOM; procurement via SEWP V, ITES-4H, and SLED vehicles.
Architects validate thermals, fabric, and imaging baselines in Fremont before freight—one integrator remains accountable through handoff.
Use the paths below to continue into related catalogs, or request an architecture review on your vehicle.
Every configuration is engineer-to-order: NTS validates power, cooling, firmware, and drivers in Fremont before systems ship.
Federal, defense, and SLED buyers can request CLIN-aligned quotes on SEWP V, ITES-4H, GSA, or cooperative vehicles; commercial teams receive the same staging discipline.
NTS documents rack elevation, PDU draw, thermal headroom, and driver baselines on every RFQ so facility teams are not discovering constraints at install.
Related storage, networking, and software lines can ride the same quote when your vehicle and SOW allow—keeping multi-vendor programs under one accountable integrator.
Buying with NTS
Catalog paths with integrator accountability
Browse the platforms below, then configure or request an architecture review.
Category hubs organize NTS Elite and partner platforms by form factor and workload. Cards open deeper catalogs or configuration lists; related GPU, storage, and networking options stay on one accountable BOM.
Use Configure on product pages for CPU, memory, accelerators, and drives. For multi-rack or liquid-cooled designs, contact engineering early so facility constraints inform the quote.
After you shortlist a platform, use product Configure pages for BOM options or request an architecture review for multi-rack, liquid-cooled, or dual-vendor GPU comparisons.
Product categories
Explore our server platforms
Rackmount, GPU, blade, storage, cluster, high-density, and Ampere — engineered for scalability and efficiency.
- Engineer-to-order
- Burn-in included
- Contract quoting
- Engineer-to-order
- Burn-in included
- Contract quoting
Frequently asked questions
Compute nodes, interconnect, storage bandwidth, cooling, and acceptance tests - treated as one system, not disconnected line items.
- Topology diagrams
- Burn-in patterns
Follow the codes: some remain CPU/MPI-bound; others gain from accelerators. NTS maps both before silicon lock.
- FP64 considerations
- ROCm/CUDA paths
Yes - milestone schedules cover long-lead GPUs/fabric while early nodes land for software bring-up.
- No silent substitutions
- Vehicle-aligned CLINs
Available kW, cooling type, floor loading, and network demarc. Missing facility data is the top cause of re-quotes.
- Worksheets provided
- On-site options
