NTS Elite Fusion 6U Liquid-Cooled GPU Server for AI & HPC Workloads

Part#: FSNI016U10-L
  • 6U 10-node front access server system
  • Dual Intel® Xeon® 6900-Series Processors per node
  • 12-Channel DDR5 RDIMM / MRDIMM, 24 x DIMMs per node
  • 2 x E3.S Gen5 NVMe hot-swap bays per node
  • 3 x LP PCIe Gen5 x16 slots per node
  • 10 x 3200W 80 PLUS Titanium redundant power supplies
Configure & Buy Features Specifications

Boosting Individual Applications with On-Point Features

 

 

Intel® Xeon® 6 is a new generation of processors that has tailored its CPU lineup to target all uses cases such as Cloud Computing, AI, Analytics, and Edge & IOT. Whether it's high compute density that is dependent on core count and power efficiency or AI/HPC applications that heavily rely on strong single-core performance, this new platform covers them all with its Performance cores (P-cores) and Efficient-cores (E-cores). Along with flexible I/O options, integrated accelerators, and support for CXL 2.0 devices, Intel Xeon 6 fulfills customer needs across the broadest range of data center workloads, segments, and deployment models.

 

 

    Core Technology Aligned with Aspirations

 

    • Accelerators built-in* Incredible performance and efficiency improvements with the easy adoption of on-chip accelerators.
    • 8 or 12 Channels Increased memory frequency and throughput with DDR5 RDIMM support.
    • PCIe 5.0 lanes Up to 136 lanes for 1S designs, supporting all the latest drives and accelerators.
    • CXL 2.0 support** Flexible support between PCIe and CXL, utilizing DDR5 and CXL memory as one unified region.
    • Up to 288 E-cores per CPU Core dense and optimized efficiency for cloud-native and hyperscale workloads.
    • Up to 128 P-cores per CPU Greater core performance with improved TCO, accelerating AI and compute intensive workloads
    • MRDIMM support Unprecedented frequency on the advanced MRDIMM, boosting memory-intensive application to a whole new level

 

 

High CPU Performance

 

The best in computational performance relies on a system well designed by our engineers to adequately dissipate heat to achieve peak performance.

Energy Efficiency

 

Our engineers have baked in features to achieve higher efficiency from power supplies and server fans. Along with Titanium and Platinum offerings.

Optimal Price

 

GIGABYTE releases multiple product models and configurations to target exactly what users want without paying for extra features that go unused.

Ease of Administration

 

GIGABYTE servers come with GIGABYTE Management Console for server management. Using a web based browser remotely is key to easing management.

Continuous Operation

 

Systems are rigorously designed and tested to ensure downtime will not occur. Customers have come to expect stable performance.

Automatic Fan Speed Control

 

GIGABYTE servers are enabled with Automatic Fan Speed Control to achieve the best cooling and power efficiency. Individual fan speeds will be automatically adjusted according to temperature sensors strategically placed in the servers.

 

Cold Redundancy

To take advantage of the fact that a PSU will run at greater power efficiency with a higher load, GIGABYTE has introduced a power management feature called Cold Redundancy for servers with N+1 power supplies. When the total system load falls lower than 40%, the system will automatically place one PSU into standby mode, resulting in a 10% improvement in efficiency.

 

 

Flexible and Resilient Management Architecture

 

  • The integration of CMC technology and auto-IP detection enables seamless switching between star and resilient ring topologies for maximum deployment flexibility. The bi-directional ring design significantly enhances cluster stability by automatically rerouting traffic upon failure to ensure uninterrupted oversight and self-healing connectivity across the remaining nodes.

 

  Dimensions6U 10-Node - Front access (W447 x H262.3 x D900 mm)
Motherboard 
MA84-HD3
CPUIntel Xeon 6 Processors
Intel Xeon 6900-Series Processors
Dual processor per node, TDP up to 500W
Socket
20 x LGA 7529
ChipsetSystem on Chip
 Memory12-Channel DDR5 RDIMM/MRDIMM, 24 x DIMMs per node
[RDIMM] Up to 6400 MT/s
[MRDIMM] Up to 8800 MT/s
 LAN
Front:
1 x 10/100/1000 Mbps Management LAN per node
Rear:
2 x Chassis Management LAN

 Video
Integrated in ASPEED AST2600
- 1 x Mini-DP per node
Storage
Front hot-swap:
2 x E3.S Gen5 NVMe per node

PCIe Expansion Slots
3 x LP PCIe Gen5 x16 per node
I/O Ports 
Front (per node):
2 x USB 3.2 Gen1, 1 x Mini-DP, 1 x MLAN
Rear:
2 x CMC ports, 1 x CMC status LED
TPM
1 x TPM header (SPI) per node, Optional TPM2.0 kit: CTM012
Power Supply
10 x 3200W 80 PLUS Titanium redundant power supplies
AC Input: 100-240V

System Fans 
10 x 80x80x80mm
Operating
Properties
Operating: 10°C to 25°C, 8% to 80% (non-condensing)
Non-operating: -40°C to 60°C, 20% to 95% (non-condensing)
OPERATING SYSTEM
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