Key Applications- High Performance Computing
- Enterprise Server
- Data Center Optimized
- Database Processing and High Density Storage
- Application-Optimized Solutions
Key Features- Dual sockets P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors;CPU TDP supports Up to 270W TDP;3 UPI up to 11.2 GT/s
- Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz, Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz ;- Up to 4TB Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MHz, in 18 DIMM slots (P1-DIMMB2 and P2-DIMMB2 are reserved for Intel® Optane Persistent Memory 200 Series only)
- 4 PCIe 4.0 x16 Low Profile (LP);
- 1 PCIe 4.0 x8 Low Profile (LP);
- * PCIe slot#1 is populated with 1x AOC-S3908L-H8IR-16DD-P to support 8x SAS drives
- Dual 10GBase-T LAN with Intel® X550 Ethernet Controller
- 3 heavy duty Hot-swappable 13.5K RPM Middle Cooling Fans with optimal fan speed control;1 air shroud
- 1200W Redundant Power Supplies Titanium level 100-240Vac and 200-240 Vdc
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