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GIGABYTE G894-SD3-AAX7 NVIDIA HGX B300

HPC/AI Server - Intel Xeon 6 Processors - 8U DP NVIDIA HGX B300 AI | HPC | AI Training | AI Inference
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  • NVIDIA HGX B300
  • 8 x 800 Gb/s OSFP InfiniBand XDR / Dual 400 Gb/s Ethernet GPU networking ports
    via onboard NVIDIA ConnectX-8 SuperNIC
  • 1.8TB/s GPU-to-GPU bandwidth with NVIDIA NVLink  and NVSwitch
  • Dual Intel Xeon  6700/6500-Series Processors
  • 8-Channel DDR5 RDIMM / MRDIMM, 32 x DIMMs
  • Dual ROM Architecture
  • Compatible with NVIDIA BlueField-3 DPUs
  • 2 x 10Gb/s LAN ports via Intel X710-AT2
  • 2 x M.2 slots with PCIe Gen5 x4 and x2 interface
  • 8 x 2.5" Gen5 NVMe hot-swap bays
  • 4 x FHHL PCIe Gen5 x16 slots
  • 12 x 3000W 80 PLUS Titanium redundant power supplies

Configure & Buy Features Specifications

GIGABYTE G894-SD3-AAX7 GPU Server

 

 

 

                Boosting Individual Applications with On-Point Features

 

Intel® Xeon® 6 is a new generation of processors that has tailored its CPU lineup to target all uses cases such as Cloud Computing, AI, Analytics, and Edge & IOT. Whether it's high compute density that is dependent on core count and power efficiency or AI/HPC applications that heavily rely on strong single-core performance, this new platform covers them all with its Performance cores (P-cores) and Efficient-cores (E-cores). Along with flexible I/O options, integrated accelerators, and support for CXL 2.0 devices, Intel Xeon 6 fulfills customer needs across the broadest range of data center workloads, segments, and deployment models.

 

 

 Core Technology Aligned with Aspirations

 

  • Accelerators built-in* -Incredible performance and efficiency improvements with the easy adoption of on-chip accelerators.
  • 8 or 12 Channels Increased memory frequency and throughput with DDR5 RDIMM support.
  • PCIe 5.0 lanes Up to 136 lanes for 1S designs, supporting all the latest drives and accelerators.
  • CXL 2.0 support**-Flexible support between PCIe and CXL, utilizing DDR5 and CXL memory as one unified region.
  • Up to 288 E-cores per CPU Core dense and optimized efficiency for cloud-native and hyperscale workloads.
  • Up to 128 P-cores per CPU Greater core performance with improved TCO, accelerating AI and compute intensive workloads.
  • MRDIMM support Unprecedented frequency on the advanced MRDIMM, boosting memory-intensive application to a whole new level.

 

 

High CPU Performance

 

The best in computational performance relies on a system well designed by our engineers to adequately dissipate heat to achieve peak performance.

Energy Efficiency

 

Our engineers have baked in features to achieve higher efficiency from power supplies and server fans. Along with Titanium and Platinum offerings.

Optimal Price

 

GIGABYTE releases multiple product models and configurations to target exactly what users want without paying for extra features that go unused.

Ease of Administration

 

GIGABYTE servers come with GIGABYTE Management Console for server management. Using a web based browser remotely is key to easing management.

Continuous Operation

 

Systems are rigorously designed and tested to ensure downtime will not occur. Customers have come to expect stable performance.

Optional TPM 2.0 Module

 

For hardware-based authentication, the passwords, encryption keys, and digital certificates are stored in a TPM module to prevent unwanted users from gaining access to your data. GIGABYTE TPM modules come in either a Serial Peripheral Interface or Low Pin Count bus.

 

 

 

 

 

G4L3‑ZD1‑LAX5 GPU Server

High Performance

 

Supports NVIDIA HGX™ B300

 

NVIDIA HGX™ B300 is built for the age of AI reasoning with enhanced compute and increased memory. Featuring 7X more AI compute than Hopper platforms, 2.3TB of HBM3E memory, and high-performance networking integration with NVIDIA® ConnectX®-8 SuperNICs, Blackwell Ultra delivers breakthrough performance on the most complex workloads from agentic systems and reasoning, to real time video generation for every data center.

 

 

Value-added Management

GIGABYTE Management Console

  • For management and maintenance of a server or a small cluster, users can use the GIGABYTE Management Console, which is pre-installed on each server. Once the servers are running, IT staff can perform real-time health monitoring and management on each server through the browser-based graphical user interface. In addition, the GIGABYTE Management Console also provides

 

  • Support for standard IPMI specifications that allows users to integrate services into a single platform through an open interface

 

  • Automatic event recording, which can record system behavior 30 seconds before an event occurs, making it easier to determine subsequent actions

 

  • Integrate SAS/SATA/NVMe devices and RAID controller firmware into GIGABYTE Management Console to monitor and control Broadcom® MegaRAID adapters.

GIGABYTE Server Management (GSM)

 

GSM is a software suite that can manage clusters of servers simultaneously over the internet. GSM can be run on all GIGABYTE servers and has support for Windows and Linux. GSM can be downloaded from the GIGABYTE website and complies with IPMI and Redfish standards. GSM includes a complete range of system management functions that includes the following utilities:

  • GSM Server: A software program that provides real-time, remote control using a graphical user interface through an administrator’s computer or through a server in the cluster.
  • GSM CLI: A command-line interface for monitoring and managing remotely.
  • GSM Agent: Installed on each GIGABYTE server node to retrieve system and device information through the OS, integrating with GSM Server or CLI.
  • GSM Mobile: A mobile app for Android and iOS that provides admins with real-time system information.
  • GSM Plugin: An API that allows users to use VMware vCenter for real-time monitoring and management of server clusters.

 

 

 

   Dimensions (WxHxD, mm)8U 447 x 351 x 923
 Motherboard
MSB4-PE2
 CPU- Intel® Xeon® 6 Processors
- Intel® Xeon® 6700-Series Processors
- Intel® Xeon® 6500-Series Processors

  Dual processor, TDP up to 350W
Socket2 x LGA 4710
Socket E2
Chipset
System on Chip
    Memory32 x DIMM slots
Support DDR5 RDIMM/MRDIMM [1]
8-Channel memory per processor
RDIMM: Up to 6400 MT/s (1DPC), 5200 MT/s (2DPC)
MRDIMM: Up to 8000 MT/s
    LANFront (I/O board - CFPG440):
2 x 10Gb/s LAN (1 x Intel® X710-AT2)
- Support NCSI function

1 x 10/100/1000 Mbps Management LAN

Rear:
8 x 800 Gb/s OSFP InfiniBand XDR / Dual 400 Gb/s Ethernet, for GPU networking, via NVIDIA ConnectX®-8 SuperNIC™

Rear (MLAN board - CDB66):
1 x 10/100/1000 Mbps Management LAN
    Video
Integrated in ASPEED® AST2600
- 1 x VGA port
   Storage
Front hot-swap:
8 x 2.5" Gen5 NVMe
- (NVMe from PEX89072)

Internal M.2:
1 x M.2 (2280/22110), PCIe Gen5 x4, from CPU_1
1 x M.2 (2280/22110), PCIe Gen5 x2, from CPU_1
Modular GPU
NVIDIA HGX™ B300 with 8 x SXM GPUs
PCIe Expansion Slots
PCIe Bridge Board - CPBG045 x 2:
4 x FHHL x16 (Gen5 x16), from PEX89072
Front I/O
I/O board - CFPG440:
2 x USB 3.2 Gen1 ports (Type-A)
1 x VGA port
2 x RJ45 ports
1 x MLAN port (default)
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x Storage activity LED
1 x System status LED
Rear I/O
8 x OSFP ports

MLAN board - CDB66:
1 x MLAN port
Security Modules
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM012
Power Supply
12 x 3000W 80 PLUS Titanium redundant power supplies
System Fans
Motherboard:
2 x 60x60x56mm
4 x 60x60x76mm

OSFP ports:
4 x 40x40x56mm

PCIe slots:
2 x 80x80x56mm

GPU tray:
15 x 80x80x80mm
Operating PropertiesOperating temperature: 10°C to 30°C
Operating humidity: 8% to 80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20% to 95% (non-condensing)
Packaging Dimensions
1200 x 800 x 620 mm
 
Packaging Content
1 x G894-SD3-AAX7
2 x CPU heatsinks
4 x Carriers
1 x L-shape Rail kit
Part Numbers
- Barebone with NVIDIA module: 6NG894SD3DR000AAX7*
- Motherboard: 9MSB4PE2UR-000*
- L-shape Rail kit: 25HB2-UM6100-K0R
- CPU heatsink: 25ST1-323208-A0R
- Front panel board - CFPG440: 9CFPG440NR-00*
- Backplane board - CBPG641: 9CBPG641NR-00*
- Fan module 40x40x56mm: 25ST2-405630-S1R
- Fan module 60x60x56mm: 25ST2-665623-S1R
- Fan module 60x60x76mm: 25ST2-667621-A0R
- Fan module 80x80x56mm: 25ST2-885622-A0R
- Fan module 80x80x80mm: 25ST2-888038-A0R
- PCIe bridge board - CPBG045: 9CPBG045NR-00*
- Rear MLAN board - CDB66: 9CDB66NR-00*
- Power supply: 25EP0-203K01-D0S
OPERATING SYSTEM
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